Tag Archives: Electronics

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Asahi Kasei presents concept car at electronica 2018

Asahi Kasei presents concept car at electronica 2018

AKXY interior (Source: @Asahi Kasei)

Düsseldorf, November 05, 2018 – The Japanese technology company Asahi Kasei will present its technologies and solutions in the areas of sensor technology and premium audio at this year’s electronica, the renowned electronics trade fair in Munich. For the first time at a European trade fair, the electric concept vehicle „AKXY“ will also be present at the booth.

Asahi Kasei presents 36 innovative materials and solutions for the mobility of the future with its specially designed „rolling competence center“ AKXY. Thereby, the cross-divisional innovation approach of the company, which combines the business areas electronics, synthetic rubber, high-performance plastics and textiles, becomes evident. The second highlight at the fair is a „Premium Audio Lounge“, where visitors can experience Asahi Kasei’s premium audio solutions live on site.

Safety drives with you: Sensors for safe and comfortable driving
A special focus of the electronic components in the AKXY is on solutions that make driving safer and more comfortable. For example, the progressive CO2 sensor solution „Sensor Sunrise“, which ensures more concentrated and safer driving. It measures the carbon dioxide content in the car cabin and contributes to better air quality. Senseair Sunrise is produced by the Swedish subsidiary Senseair and is the world’s first optical solid-state NDIR sensor for measuring gases such as carbon dioxide. With an unsurpassed low power consumption – six times lower than that of comparable NDIR sensors – it can easily be integrated into battery-powered systems.

Undisturbed conversations in the car
Driving fast or the playing of music can considerably impair the conversation between driver and passengers. The consequences are inattentive driving and an increased risk for all road users. Asahi Kasei has developed a special solution for this: The digital signal processor (DSP) – as an in-car communication application – ensures safe and comfortable conversations in the car without the driver having to turn his head. With its Engine Sound Creator application, the DSP contributes to an improved driving experience and increased road safety by providing a realistic engine sound.

Solutions for autonomous driving
Intelligent driver assistance systems are experiencing tremendous market growth, with radar sensors playing an important role in the overall system architecture due to their unique capabilities. With the Transceiver IC, Asahi Kasei offers a standard component that increases the performance and precision of the radar sensor in object localization and contributes to improved discrimination accuracy between people and vehicles.

„Sensor island“ and „Premium Audio Lounge“
Asahi Kasei will be exhibiting its concept car in Hall B4 – Booth 516. Additionally, the company will show further sensor solutions on its „sensor island“. A highlight in addition to CO2 and 3D sensors is a newly developed presence sensor, which has very low energy consumption and does not require a lens at all. Further sensor solutions will be presented by Senseair in Hall B3 – Booth 441.

Asahi Kasei has been a premium supplier of D/A and A/D converters as well as digital signal processors (DSP) for high-class audio applications for 25 years. In a specially equipped „Premium Audio Bar“, visitors can convince themselves of the product quality on site. Registrations for a guided tour will be accepted at the booth.

The Asahi Kasei Group is a diversified group of companies led by Asahi Kasei Corp., with operations in the Material, Homes, and Health Care business sectors. Asahi Kasei distributes its innovative technologies and unique materials on markets worldwide.
With more than 30,000 employees around the world, the Asahi Kasei Group serves customers in more than 100 countries. Asahi Kasei is „Creating for Tomorrow“ with all operations sharing a common mission of contributing to life and living for people around the world.

Company-Contact
Asahi Kasei Europe GmbH
Sebastian Schmidt
Am Seestern 4
40547 Düsseldorf
Phone: +49 (0)211 280 68 139
E-Mail: Sebastian.Schmidt@asahi-kasei.eu
Url: https://www.asahi-kasei.eu/

Press
financial relations GmbH
Henning Küll
Louisenstraße 97
61348 Bad Homburg
Phone: +49 (0) 6172 27159 12
E-Mail: h.kuell@financial-relations.de
Url: http://www.financial-relations.de

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InPrint 2017: Tichawa Vision Presents VTCIS and VDCIS with all new Features

100% quality control for print products with high-precision CIS sensors

InPrint 2017: Tichawa Vision Presents VTCIS and VDCIS with all new Features

The VTCIS detects missing nozzles automatically in the print image at a resolution of 1200 dpi

Friedberg, 17th Oktober 2017. On the 14th till 16th November in Munich, Tichawa Vision GmbH will be introducing not one, but two new innovations during their first showing at the trade fair InPrint. At their booth #254 in Hall A6, the specialist for high-precision CIS sensors will be presenting the VTCIS as well as the internationally acclaimed VDCIS. The industrial scanner streamlined for digital, inkjet and security printing has been equipped with new functions, which automatically recognize missing nozzles at a resolution of 1200 dpi. With its increased operating distance and depth of field, the VDCIS opens up completely new fields of application such as Direct-to-shape Printing and the inspection of strongly profiled surfaces in near 3D quality.

The trade fair InPrint is the ideal venue for Tichawa Vision for introducing their new CIS technologies, which were developed especially for the printing industry. „The demands of industrial printing on paper, metal, plastic and other surfaces are growing while the standards for quality are also continually increasing. Our products are a response to market demands. We develop CIS sensors which come with a 100% quality control guarantee for manufacturers and refiners“, explains Dr. Nikolaus Tichawa, CEO of Tichawa Vision GmbH.

Automatic recognition of missing nozzles at a resolution of 1200 dpi

The VTCIS is capable of automatically detecting missing nozzles in the print image at a resolution of 1.200 dpi. Tichawa has also equipped the VTCIS with the all new feature „Regions of Interest“. The CIS only scans particular section rather than processing the complete image, simplifying data processing and significantly reducing data volume. The integrated liquid cooling guarantees color stability throughout the whole printing process, thereby eliminating color deviations.

The VTCIS is currently market-leading among camera systems for quality control in terms of compactness and scanning speed. Thanks to the remarkable line rate of up to 250 kHz and a scanning speed of up to 20 m/s, the VTCIS is perfectly suited for all very fast running print processes. The optional sensor is available with a reading width of 260 to 1560 Millimeters.

VDCIS impresses with outstanding qualities

The VDCIS, which was awarded Gold during this year“s Vision Systems Innovators Awards, is specially designed for the surface inspection of high profiled surfaces as well as products made of glass, wood, metal, plastics and ceramics. A great improvement is the increase of the operating distance between the sensor screen and the test object from a range of 10 Millimeters to a range of 60 to 80 Millimeters. At the same time, the depth of field has been increased from about 1 Millimeter to 15 Millimeters, enabling the CIS sensor to look deeper. It can, for example, determine whether any pills are missing in the packaging or inspect labels on cans, bottles, cylindrical shapes and other curved surfaces.

Due to its slim and very compact build, companies can easily install the VDCIS into their machinery at minimal expense. The sensor can be equipped with an optional scanning width of 300 to 1.800 Millimeters. The VDCIS is available with adjustable resolution (250 to 1.000 dpi) as well as with the lighting combinations RGB and monochrome (black/white). These groundbreaking features make the VDCIS product line deployable to completely new fields of application, such as Direct-to-Shape Printing or the inspection of strongly profiled surfaces in near 3D quality.

Visit Tichawa Vision at InPrint 2017 in Hall A6, Booth 254.

About Tichawa Vision
Since the foundation in 1991, Tichawa Vision GmbH has specialised in the development, production and distribution of camera technologies for industrial image processing for the purpose of optical surface inspection and product control. Tichawa is the worldwide leader in the field of Contact Image Sensors (CIS), which -consisting of a reading line, an integrated lens and an optimized light source -generate reliable analytical results with an aspect ration of 1:1 for applications as well as glass processing, silk screen printing, wafer inspection, sorting of postal items or automation technology.

epr is an owner-managed agency for press and public relations based in Augsburg. With creative solutions, epr supports local, national and international companies and institutions in building a brand and image. Founded in Augsburg in 2007, the agency offers many years of experience in consulting and implementation of PR and marketing concepts as well as in the area of press and public relations. For further information: www.epr-online.de

Contact
epr – elsaesser public relations
Cornelie Elsässer
Maximilianstraße 50
86150 Augsburg
Phone: +498214508790
Fax: +4982145087920
E-Mail: ce@epr-online.de
Url: http://www.epr-online.de

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ZETTLER electronics at electronica 2016

Showcasing the full range of components, including innovative solar-power relays, displays and switching power supplies

ZETTLER electronics at electronica 2016

Munich, Germany, September 20, 2016 – At electronica 2016, ZETTLER electronics GmbH (http://www.zettlerelectronics.com/) will showcase its full range of products. The manufacturer and distributor of electromagnetic and electronic components will once again be present at the ZETTLER Group (http://www.zettler-group.com/) booth (Hall A2/655). Here, ZETTLER will be demonstrating the full breadth of its extensive know-how in the business areas: Relays, Displays, Magnetics und Controls.

– Relays: Innovative product lines of high-grade, cost-efficient components for the modern industry and consumer electronics, e.g., automotive relays, signal relays as well as special relays for highly specific applications and switching power supplies.

With its wide range of powerful solar relays (e.g., AZSR180) ZETTLER electronics is responding to continually increasing need for inverter-design driven specifications related to physical size, energy efficiency and relay safety features.

– Displays: ZETTLER will also introduces its portfolio of innovative TFT panels with capacitive touch technology, LCD modules as well as PMLCD and OLED. The wide spectrum of TFT Modules is made for numerous applications such as Avionics, Medical, Navigation Systems, Industrial Controls, Irrigation Controls, Testing/Measurement devices and Smart Metering.

– Magnetics: A variety of top quality winding goods will be presented, e.g., transformers, chokes, coils as well as switched-mode power supply modules for PCB mounting.
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– Controls: The controls portfolio offers industry leading and highly specialized support services to the HVAC/R market with a comprehensive product line, including relays, contactors and bimetal thermostatic switches.

„At electronica, ZETTLER electronics can fully demonstrate its extensive know-how and experience in the field of electromagnetic and electronic components“, explains Alexander Stöckel, Productmanagement Electromechanical Components at ZETTLER electronics. „Our shared booth with ZETTLER Group showcases our full service capabilities. We provide solutions for component applications across the industrial and commercial markets and a broad spectrum of other industries. Our products inspire innovation and support engineers from the design through to production phase.“

Download of High-Quality Images: ZETTLER electronics Booth (http://www.lucyturpin.de/PR/Zettler/2016/Images/ZETTLER_electronica2014.JPG)

Further Information on ZETTLER electronics:
– ZETTLER electronic Website (http://www.zettlerelectronics.com/cms/front_content.php?idcat=5&lang=2)
– Video ZETTLER Relays Production Line (http://www.zettlerelectronics.com/cms/front_content.php?idcat=122)
– ZETTLER Group Website (http://www.zettler-group.com/home/)

Building on more than a century of expertise in German precision engineering, ZETTLER GROUP is a world-class enterprise, engaged in the design, manufacturing, sales and distribution of electronic components. Its industry leadership is based on a unique combination of engineering competence and global scale. ZETTLER GROUP“s diversified product lines are designed to provide complete solutions for component applications across a broad spectrum of industries, including relays, magnetics, displays, controls and new energy solutions. With a global network of companies ZETTLER GROUP is not only present in low cost manufacturing geographies, but also has the ability to provide customer-focused solutions in proximity to local industrial and commercial markets. Located near Munich, Germany, ZETTLER Electronics GmbH serves as the European headquarters for ZETTLER Group and operates through a comprehensive network of distributors across nineteen countries, including all the key markets of the European Union, Scandinavia, Israel, and Turkey.

Firmenkontakt
Zettler electronics GmbH
Alexander Stöckel
Junkersstr. 3
82178 Puchheim (München)
+49 89-800-97-0
Alexander.Stoeckel@ZETTLERelectronics.com
www.zettlerelectronics.com

Pressekontakt
Lucy Turpin Communications GmbH
Birgit Fuchs-Laine
Prinzregentenstrasse 79
81675 München
+49 (0)89 – 41 77 61 – 13
zettler@lucyturpin.com
www.lucyturpin.com

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Wide Contact Gap Solar Relay: ZETTLER electronics‘ 80 A High Power PCB Relay

High power PCB relay with wide contact gaps and patented thermal bridge to meet higher isolation requirements and prevent critical overheating in PV applications

Wide Contact Gap Solar Relay: ZETTLER electronics

Munich, Germany, June 16, 2016 – The ZETTLER electronics GmbH (http://www.zettlerelectronics.com/), a manufacturer and distributor of electromagnetic and electronic components, has announced the availability of its new single pole 80 A solar relay. The innovative AZSR180 series is designed for the photovoltaic industry, to fulfill solar inverter and other application requirements.

Developed for PV applications of up to 20kVA (single phase) / 55kVA (three phase), this high power PCB relay is well suited for medium sized to larger roof top-based as well as commercial systems, deployable up to 4,000 meters above sea level. It can handle 80 A current at an energy efficient holding power of only 100 mW and offers a dielectric strength of 5,000 Vrms. The wide contact gap (> 2.05 mm) and large isolation spacing (> 10 mm) support extended requirements for use in photovoltaic applications.

A special feature of AZSR180 is a thermally-conductive copper bridge that connects the two parallel contact springs for level distribution of any excessive heat between the two contacts. Even in an extremely seldom case of a total failure of one of the two parallel-connected contacts, this „thermal bridge“ prevents critical overheating of the latter contact and thus relay destruction.

With the AZSR180, Zettler has demonstrated its commitment to continue expanding its wide range of innovative AC side solar relays. The company is responding to ever-increasing inverter-design driven specifications related to physical size, energy efficiency and relay safety features. In parallel, it is also meeting demands for higher isolation requirements (e. g., IEC 62109 and UL 62109), as well as higher kVA capacities and switching currents.

For a complete listing of Zettler“s relay solutions please visit the website (http://www.zettlerelectronics.com/cms/front_content.php?idart=9). For technical information and preliminary datasheets please contact ZETTLER electronics GmbH (http://www.zettlerelectronics.com/cms/front_content.php?idart=9).

Contact data
– Max. switched / continuous current80 A
– Max. switched power2,400 W or 22,160 VA
– Max. switched voltage150 VDC or 440 VAC
– Rated load 80 A at 277 VAC, resistive
– Contact gap > 2.05 mm

Coil data
– Power at pickup voltage (typical)270 mW
– Power max. continuous dissipation2.0 W at 20° C (68° F) ambient
– Power temperature rise15° C (27° F) at nominal coil voltage

Isolation data
– Dielectric strength 5,000 Vrms coil to contact / 2,500 Vrms between open contacts
– Isolation spacing> 10 mm
– Reinforced isolationEN 60730-1 (VDE 0631, part1), EN 60335-1 (VDE 0700, part1)

Mechanical
– Ambient temperature -40° C (-40° F) to 85° C (185° F)
– Vibration0.062″ (1.5 mm) DA at 10-55 Hz
– Shock10 g

Building on more than a century of expertise in German precision engineering, ZETTLER GROUP is a world-class enterprise, engaged in the design, manufacturing, sales and distribution of electronic components. Its industry leadership is based on a unique combination of engineering competence and global scale. ZETTLER GROUP“s diversified product lines are designed to provide complete solutions for component applications across a broad spectrum of industries, including relays, magnetics, displays, controls and new energy solutions. With a global network of companies ZETTLER GROUP is not only present in low cost manufacturing geographies, but also has the ability to provide customer-focused solutions in proximity to local industrial and commercial markets. Located near Munich, Germany, ZETTLER Electronics GmbH serves as the European headquarters for ZETTLER Group and operates through a comprehensive network of distributors across nineteen countries, including all the key markets of the European Union, Scandinavia, Israel, and Turkey.

Firmenkontakt
Zettler electronics GmbH
Alexander Stöckel
Junkersstr. 3
82178 Puchheim (München)
+49 89-800-97-0
Alexander.Stoeckel@ZETTLERelectronics.com
www.zettlerelectronics.com

Pressekontakt
Lucy Turpin Communications GmbH
Birgit Fuchs-Laine
Prinzregentenstrasse 79
81675 München
+49 (0)89 – 41 77 61 – 13
zettler@lucyturpin.com
www.lucyturpin.com

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MOST® and AUTOSAR

MOST Forum 2015: MOST Cooperation Will Present the Integration of AUTOSAR within the MOST Network

MOST® and AUTOSAR

Integration of AUTOSAR within the MOST Network

The MOST® Cooperation – standardization organization for the leading automotive multimedia network technology Media Oriented Systems Transport (MOST) – will present an implementation of MOST within the AUTOSAR framework at the upcoming MOST Forum on April 21, 2015 in Stuttgart/Esslingen (Germany). AUTOSAR (AUTomotive Open System Architecture, www.autosar.org) has developed a standardized open software architecture for automotive electronic control units and is increasingly being applied in traditional vehicle electronics domains. MOST, on the other hand, is an important standard for automotive infotainment. „MOST Technology is used to connect various domains in the vehicle, and is compatible with many different standards such as AUTOSAR,“ stated Dr. Wolfgang Bott, Technical Coordinator of the MOST Cooperation. „There are several cases where it is useful for MOST and AUTOSAR to interoperate.“

A demonstrator will show a MOST/AUTOSAR gateway that connects the vehicle network with a MOST network using AUTOSAR mechanisms. In a second approach, the communication of two AUTOSAR applications is tunneled through a MOST network, either through the MOST Control Channel or over the MOST Ethernet Channel.

About MOST Technology
MOST (Media Oriented Systems Transport) is a multimedia networking technology optimized for use in cars and other applications. It enables the transport of high Quality of Service audio and video together with packet data and real-time control over a single transmission medium. MOST can use plastic optical fibers (POF), coax based electrical physical layer, and shielded and unshielded twisted pair (STP/UTP) copper wires that meet automotive environmental requirements. Today, MOST is used in over 170 car models as the communication backbone for their information and entertainment equipment.

About MOST Cooperation
The MOST Cooperation (MOSTCO) is the organization through which MOST Technology is standardized and refined so that it continues to stay abreast of the latest industry requirements. Today, it consists of 17 international carmakers and over 55 key component suppliers. They have joined together to work with the MOST Technology and to contribute to its innovation. The MOST Cooperation is prepared to embrace efforts to further develop and standardize the technology for other industries and to establish the corresponding work structures. The MOST Cooperation was founded in 1998 to standardize MOST Technology as a global standard for multimedia networking. Audi, BMW, Daimler, HARMAN and Microchip Technology are its core partners and constitute its Steering Committee. For more information see http://www.mostcooperation.com.

Firmenkontakt
MOST Cooperation
Mandy Ahlendorf
Bannwaldallee 48
76185 Karlsruhe
+49 8151 9739098
mostco_pr@mostcooperation.com
http://www.mostcooperation.com

Pressekontakt
ahlendorf communication
Mandy Ahlendorf
Schiffbauerweg 5F
82319 Starnberg
+4981519739098
ma@ahlendorf-communication.com
www.ahlendorf-communication.com

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Fujitsu Introduces Ultra-Low-Power FRAM with Integrated Counter Function

A perfect match for sensor and energy harvesting applications in industrial automation

Fujitsu Introduces Ultra-Low-Power FRAM with Integrated Counter Function

Fujitsu introduces an ultra-low-power FRAM with an integrated counter function.

Langen, Germany, December 8th, 2014 – Fujitsu Semiconductor Europe (FSEU) today announced the release of MB85RDP16LX, an ultra-low-power FRAM device with an integrated binary counter function. The new device incorporates multiple optimisations to slash energy consumption to less than 10% of that required by standard FRAM solutions. With MB85RDP16LX, Fujitsu is targeting industrial automation applications involving energy harvesting for rotary encoders, motor control and sensors. The ultra-low-power device can enable self-powering solutions such as the Wiegand wire-based platform being offered by iC-Haus (https://www.ichaus.de/) .

Significant energy savings have been achieved by integrating the counter function into the FRAM device. Conventional system environments using standard memory require the MCU to read data from the memory device before performing computation and then writing new data back to the memory to complete the counting operation. In contrast, MB85RDP16LX replaces these separate read/write operations with a single command from the MCU, resulting in energy savings of up to 94%.

The power-up time of MB85RDP16LX has been optimised to 5 microseconds, which is 38 times faster than standard FRAM devices. This enables extremely fast device wake-up while consuming as little energy as possible.

MB85RDP16LX can be connected via single- and dual-SPI interfaces. A dual SPI interface offers customers the option of halving the clock frequency: this achieves further power saving gains without impacting performance.

To satisfy the broad temperature ranges required by the industrial automation market, MB85RDP16LX has been specified for an operating temperature range of -40-105 °C without compromising its 10-year data retention time.

MB85RDP16LX is being offered in an SON-8 package: with physical dimensions of 2 mm x 3 mm, this permits the design of miniature devices. Compared to typical SOP-8 packages, over 80% of the memory’s PCB space can be saved.

Availability
MB85RDP16LX has entered mass production and samples are now available.

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

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Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Parties sign letter of intent on photo trade fair, will extend longstanding development relationship

Photokina 2014: Leica and Fujitsu Semiconductor Extend Long-Standing Cooperation Focusing on Next Generation SoC

Leica and Fujitsu Semiconductor sign letter of intent on photokina 2014 to extend cooperation.

Langen, Germany, September 18, 2014 – Leica Camera AG („Leica“) and Fujitsu Semiconductor Europe (FSEU) today signed a letter of intent, expressing their plans to extend their longstanding cooperation. The partnership will focus on developing next generation System on Chips (SoC) for Leica“s leading-edge digital cameras for professional use. FSEU“s expertise in the area of leading semiconductor design, and especially in the area of digital camera image processor SoC, already resulted in the successful development of two generations of Camera SOCs.

Both companies have an ongoing cooperation since 2008. At Photokina 2014, they presented its latest result, a new Leica S camera that features the Leica MAESTRO II image processor. Small medium-format cameras such as the Leica S-System offer excellent imaging quality and user experiences due to the high-definition imagery, fast processing speeds, and low power consumption that the Fujitsu Milbeaut series of image processing devices for cameras is able to provide.

Markus Limberger, Chief Operating Officer in the Leica Camera board, comments: „In FSEU, we have found a strong and reliable technology partner who has proven its expertise and capabilities for state-of-the-art imaging solutions over the years in the context of our cooperation. We are highly committed on fostering this relationship. As expressed in the letter of intent, Leica will, subject to availability and commercial and technological fit, solely use FSEU products of this type of SoC for its professional camera solutions.“

Inoue Amane, Corporate Senior Vice President and President of System LSI Company at Fujitsu Semiconductor Limited comments: „FSEU will fully support Leica“s requirements while developing the next generation SoC Maestro III and respective firmware. Our team of dedicated hardware and software engineers will continue merging the strengths of FSEU“s image-processing technologies with Leica“s high-definition imaging technologies and offer an industry-leading image processing solution.“ By signing the letter of intent, FSEU also commits on using a production technology of 28nm or better for future developments and providing samples to Leica as early as possible, allowing Leica a quick development.

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

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Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Joint presence at leading photo trade fair from September 16 – 21, 2014, underscores longstanding development relationship

Photokina 2014: Leica to Present New High-End Camera Leica S Featuring Leica MAESTRO II Processor built on Fujitsu Technology

Leica to present new Leica S high-end camera featuring Leica MAESTRO II image processor at Photokina

Langen, Germany, September 16, 2014 – Leica Camera AG („Leica“) and Fujitsu Semiconductor Europe (FSEU) will be presenting a new Leica S camera that features the Leica MAESTRO II image processor at the Photokina exhibition to be held in Cologne, Germany, from September 16 – 21 (booth A002, hall 01.1). The Leica S-System is a purely digital high-end camera system built for professional photographers. Small medium-format cameras offer excellent imaging quality and user experiences due to the high-definition imagery, fast processing speeds, and low power consumption that the Fujitsu Milbeaut series of image processing devices for cameras is able to provide.

Leica MAESTRO II has been built upon the latest technology from Fujitsu“s Milbeaut series. It features improved image processing algorithms and faster CPUs. The combined faster operation of both software and hardware enables superior image processing performance.

The joint presence at Photokina underscores the longstanding and successful relationship between Leica and FSEU.

Fujitsu Milbeaut series
Due to increasingly higher requirements with respect to image quality, demand for faster image processing systems, which at the same time guarantee low power consumption, continues to grow. Widely used in digital single-lens reflex (SLR), compact digital still, and mobile phone cameras, the Milbeaut series meets current market demands. Fujitsu Milbeaut technology offers various image processing and interface functions on a single chip as required by these cameras, including video and audio support.

Dr. Volker Zimmer, Head of the Digital Imaging Division of Leica, commented, „Leica delivers cutting-edge technology to professional photographers around the world. Therefore, we rely on strong technology partners such as Fujitsu who provide us with state-of-the-art imaging solutions. MAESTRO II will deliver excellent performance for our key customers.“

Strategic cooperation
In 2008, Leica and FSEU introduced a co-developed image processing system solution for high-end digital SLR cameras to be featured in Leica“s next generation cameras. For this joint development, Leica and FSEU established a team of dedicated hardware and software engineers to leverage the company“s expertise and know-how. By combining the strengths of FSEU“s image-processing Milbeaut technologies with Leica“s high-definition imaging technologies, the companies offer an industry-leading image processing solution that is also featured in the new Leica S.

„Solutions like the Leica MAESTRO II image processor presented at Photokina are the result of a long-standing development partnership with Leica,“ said Markus Mierse, Senior Director of the Imaging Business Unit of FSEU. „We will be building on this successful cooperation to keep delivering outstanding high-end cameras that combine Leica“s expertise and reputation in the camera industry with our Milbeaut image processing LSI technology.“

About Leica Camera
Leica Camera AG is an internationally operating, premium-segment manufacturer of cameras and sport optics products. The legendary status of the Leica brand is founded on a long tradition of excellence in the construction of lenses. Combined with innovative technologies, Leica products continue to guarantee better pictures in all situations in the worlds of visualisation and perception to this day. Leica Camera AG has its headquarters in Wetzlar, in the state of Hesse in Germany, and a second production site in Vila Nova de Famalicão, Portugal. The company operates branch offices in England, France, Japan, Singapore, Switzerland, South Korea, Italy, Australia and the USA. New and innovative products have been the driving force behind the company’s positive development in recent years. For more information, please see: http://en.leica-camera.com/home/

Über Fujitsu Semiconductor Europe (FSEU)

Seit 1980 bedient Fujitsu Semiconductor Europe (FSEU) die Märkte Automotive, Industrial, Communications und Home Entertainment. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt ist einer der wichtigsten Zulieferer von ‘Right-Sized’ und fortschrittlichen Halbleiterlösungen. Mit dieser Vision entwickelt FSEU nicht nur maßgeschneiderte Produkte für modernste Anwendungen, sondern bietet über seine Niederlassungen in ganz Europa und die eigene Software-Tochter (FEAT) im österreichischen Linz ausgezeichnete technische Dienstleistungen und Unterstützung an. FSEU hat das Ziel, ein integraler Bestandteil in der Lieferkette seiner Kunden zu sein. In den Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Grafikcontrollern, Multimedia ICs, kundenspezifischen SoCs (ASICs) und Embedded Software widmen, arbeiten die Ingenieure von FSEU eng mit den Marketing- und Vertriebsteams der Kunden in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Allgemein

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Das SoC unterstützt H.265-Decodierung für Set-Top-Boxen und In-Car-Infotainmentsysteme

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung in Multimedia-Anwendungen vor

Fujitsu stellt SoC-Baustein für die HEVC-HD-Decodierung (H.265) für Multimedia-Anwendungen vor.

Langen, 26. August 2014 – Fujitsu Semiconductor Europe (FSEU) stellt mit dem MB8AL2030 – Rufname HD62 – eine aktuelle Erweiterung der H6x-Decoderserie vor. Das System on Chip (SoC) unterstützt die HEVC-Decodierung, auch bekannt als H.265-Decodierung, in HD-Auflösung für Multimedia-Anwendungen in In-Car-Infotainment- und Home-Entertainment-Systeme. H.265 ist der Nachfolger des weit verbreiteten Videostandards H.264. Mit H.265 lässt sich die Komprimierung im Vergleich zum Vorgänger noch einmal verdoppeln.

HD62 bietet zudem einen H.264-Encoder und unterstützt eine 3D-Grafik-Engine, mit der die 2D/3D-OSD-Generierung, Vektorgrafiken, hochwertiges Anti-Aliasing und Videoeffekte beschleunigt werden. Der Baustein auf Basis des ARM® Cortex™ A5 Quad-Core-Prozessors wird mit umfassenden Sicherheitsfunktionen zum Schutz von Inhalten gegen Piraterie geliefert, wie beispielsweise DVB-Entschlüsselung, DTCP, geschützter Programmstart und OTP zur Speicherung geheimer Schlüssel. Die äußerst geringe Leistungsaufnahme – in der Regel 2 Watt – prädestiniert den HD62 für den Einsatz in der Verbraucherelektronik, beispielsweise in hybriden Set-Top-Boxen für TV-Übertragungen und Streaming, DVB-T2-Set-Top-Boxen und Heimnetzwerken.

Das Kind einer globalen Entwicklungsumgebung

Das HD62-SoC wurde im ASIC Competence Center von FSEU in Langen bei Frankfurt entwickelt. Hier konnten alle Vorteile des Entwicklungssystems von Fujitsu für kundenspezifische System on Chips genutzt werden. Das Entwicklungssystem integriert hochmoderne Implementierungs- und Produktionstechniken, die über Jahre hinweg mit ASICs, Designdiensten und Entwicklungswerkzeugen gepflegt und ausgebaut wurden. Fujitsu produziert das SoC mit 55-nm-Prozesstechnologie in Japan in seinem Werk in der Präfektur Mie. Geliefert wird das Produkt im PBGA-484- Gehäuse.

Verfügbarkeit

Produktmuster aus der MB8AL2030-Serie, auch als HD62 bekannt, sind seit April 2014 verfügbar. Die Serienfertigung beginnt im ersten Quartal 2015.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com

Allgemein

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

SoC supports H.265 decoding for set top boxes and in-car infotainment systems

Fujitsu Presents HEVC HD Decoding SoC for Multimedia Applications

Fujitsu presents the HEVC HD (H.265) decoding SoC for multimedia applications.

Langen, Germany, August 26, 2014 – Fujitsu Semiconductor Europe (FSEU) today introduced its newest addition to the Fujitsu H6x decoder series: the MB8AL2030 nicknamed HD62. The System on Chip (SoC) supports HEVC (H.265) decoding in HD resolution for multimedia applications in in-car infotainment and home entertainment systems. H.265 is the successor to the widely used H.264, offering double the data compression ratio compared to its predecessor.

HD62 also includes an H.264 encoder and supports a 3D graphics engine to accelerate 2D/3D OSD generation, vector graphics, high-quality anti-aliasing and video effects. It comes with comprehensive security features for content protection including DVB descrambling, DTCP, secure boot and OTP to store secure keys, and builds on an ARM® Cortex™ A5 quad-core. It offers a very low power consumption, typically 2W, which makes it ideal for use in consumer electronics such as hybrid set-top boxes for broadcasting and streaming, DVB-T2 set-top boxes and home networking.

Leveraging a global development environment

The HD62 SoC was developed in FSEU“s ASIC Competence Centre in Langen, Germany, by leveraging Fujitsu“s development system for custom System on Chips, which integrates advanced device implementation and manufacturing techniques cultivated through years of experience with ASICs, design services, and development tool kits. The SoC is produced using 55nm process technology in Fujitsu“s Mie plant in Japan and comes in PBGA-484 packaging

Availability

Sample quantities of MB8AL2030, otherwise known as HD62, have been available since April 2014. Volume production will start in the first quarter of 2015.

Über Fujitsu Semiconductor Europe (FSEU)

Fujitsu Semiconductor Europe ist einer der wichtigsten Zulieferer von „Right-Sized“ und fortschrittlichen Halbleiterlösungen. Das Unternehmen mit Hauptsitz in Langen bei Frankfurt am Main bedient die Märkte Automotive, Industrial, Communications und Home Entertainment. Die „Right-Sized“-Strategie von FSEU ist darauf ausgerichtet, Kunden maßgeschneiderte Lösungen und eine höchstmögliche Wertschöpfungstiefe bieten zu können. Ingenieure der europäischen Design-Zentren sowie Forschungs- und Entwicklungseinrichtungen von Fujitsu, die sich analoger und Mixed-Signal-Technologie, Advanced Packaging, Mikrocontrollern, Grafikcontrollern, Multimedia ICs, ASICs und Embedded Software widmen, arbeiten eng mit Marketing- und Vertriebsteams in der EMEA-Region zusammen, um den Anforderungen der Kunden an deren Systementwicklung gerecht zu werden. FSEU-Teams stehen Kunden in Langen, München, Maidenhead bei London, Paris, Mailand, Budapest, Istanbul und Linz, Österreich mit technischem und anwendungsorientiertem Support zur Seite.

Unternehmenswebsite: http://emea.fujitsu.com/semiconductor
Newsletter: http://emea.fujitsu.com/newsletter
Twitter: http://emea.fujitsu.com/twitter

Firmenkontakt
Fujitsu Semiconductor Europe GmbH
Herr Mark Ellins
Pittlerstr. 47
63225 Langen
06103-6900
mark.ellins@de.fujitsu.com
http://emea.fujitsu.com/semiconductor

Pressekontakt
Hotwire
Florian Hohenauer
Franziska-Bilek-Weg 9
80339 München
+49 (0)89 210932-74
florian.hohenauer@hotwirepr.com
http://www.hotwirepr.com